Black Antistatic Wafer Pad
Specifications
Product Name：Black Antistatic Wafer Pad Material: PE
Thickness: 0.09mm
Diameter: 300mm
With embossed surface
Surface resisitance: 10e3-10e5Ω
Specification：0.09mm×300mm
Package: 200pcs/bag, and then 5bags/carton, and then 4 small carton in o a big caron
| Inspection Report | Technical Requirements | Measured Results |
| Appearance | Special bump points | Yes |
| Color | Black | Black |
| Thickness | 0.09mm±0.02mm | Yes |
| Diameter | 300±2mm | Yes |
| Surface Resistance | GB/T 1447-93 GB/T 12582-90 | 10e4 - 10e9 Ohms |
| Tribo-Charging | GJB1649-93 (±1000-±100V)≤1 s | +V -V 0.3 0.2 0.3 0.3 0.3 0.3 |
| Density | 0.926 g/cm | Yes |
| Tensile Strength | Crosswise：37.06 Mpa longitudinal：38.90 Mpa | Yes |
| Coefficient of Friction | Outside surface：0.12 Us Internal：0.10 Ud | Yes |
| Capacitance Release Value | <15 KV | Yes |
Result of Inspection：
After testing, the resistivity of the batch of "black antistatic wafer Pad" conforms to the
relevant national standards and requirements, and is judged as qualified.
Indicate:
1. the inspection conditions: temperature T = 22.5 °C, relative humidity RH = 51.6%;
2. Main detection instrument: CHY-C1 thickness gauge; VICTOR-VC890C digital Multi-meter;
HT-8001C Digital Thermometer
